lead free solder mechanics and reliability

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Lead Free Solder

Author : John Hock Lye Pang
ISBN : 1461404630
Genre : Technology & Engineering
File Size : 48. 14 MB
Format : PDF
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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging

Author : Ephraim Suhir
ISBN : 9780387329895
Genre : Technology & Engineering
File Size : 62. 89 MB
Format : PDF, Docs
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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Lead Free Solder Interconnect Reliability

Author : Dongkai Shangguan
ISBN : 9781615030934
Genre : Technology & Engineering
File Size : 76. 59 MB
Format : PDF, Kindle
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A Guide To Lead Free Solders

Author : John W. Evans
ISBN : 9781846283109
Genre : Technology & Engineering
File Size : 89. 68 MB
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The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Fundamentals Of Lead Free Solder Interconnect Technology

Author : Tae-Kyu Lee
ISBN : 9781461492665
Genre : Technology & Engineering
File Size : 27. 49 MB
Format : PDF
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Mechanics Of Microelectronics

Author : G.Q. Zhang
ISBN : 9781402049354
Genre : Technology & Engineering
File Size : 35. 22 MB
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This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Mems And Nanotechnology Volume 5

Author : Gordon Shaw III
ISBN : 9783319007809
Genre : Technology & Engineering
File Size : 76. 99 MB
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MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology

Itherm 2002

Author : Cristina H. Amon
ISBN : 0780371526
Genre : Technology & Engineering
File Size : 84. 82 MB
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Green Electronics Manufacturing

Author : John X. Wang
ISBN : 9781439826690
Genre : Technology & Engineering
File Size : 38. 96 MB
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Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle. The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers. With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.

5th Electronics Packaging Technology Conference

Author :
ISBN : 0780382056
Genre : Electronic packaging
File Size : 90. 84 MB
Format : PDF, Mobi
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