surface mount technology terms and concepts

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Surface Mount Technology Terms And Concepts

Author : Phil Zarrow
ISBN : 9780080518206
Genre : Language Arts & Disciplines
File Size : 82. 23 MB
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In today's fast-paced world of technology, keeping up with new terms and concepts can be quite a challenge. Surface Mount Technology Terms and Concepts is an invaluable reference containing over 1000 terms and definitions used in the SMT field. Each term is followed by a paragraph or two explaining the meaning and how it fits into the surface mount industry. The easy lookup and concise explanations make it ideal for those starting out in the field as well as professionals already involved in surface mount design and assembly. Glossary of over 1000 surface mount technology terms and definitions Contains an acronyms section Comprehensive and illustrated

Design Guidelines For Surface Mount Technology

Author : John Traister
ISBN : 9780323141659
Genre : Technology & Engineering
File Size : 43. 6 MB
Format : PDF, ePub
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Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

Guide To Information Sources In Engineering

Author : Charles R. Lord
ISBN : 1563086999
Genre : Computers
File Size : 81. 79 MB
Format : PDF
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The only source that focuses exclusively on engineering and technology, this important guide maps the dynamic and changing field of information sources published for engineers in recent years. Lord highlights basic perspectives, access tools, and English-language resources--directories, encyclopedias, yearbooks, dictionaries, databases, indexes, libraries, buyer's guides, Internet resources, and more. Substantial emphasis is placed on digital resources. The author also discusses how engineers and scientists use information, the culture and generation of scientific information, different types of engineering information, and the tools and resources you need to locate and access that material. Other sections describe regulations, standards and specifications, government resources, professional and trade associations, and education and career resources. Engineers, scientists, librarians, and other information professionals working with engineering and technology information will welcome this research

Smt Soldering Handbook

Author : RUDOLF STRAUSS
ISBN : 0080480977
Genre : Technology & Engineering
File Size : 81. 40 MB
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Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology

Solder Paste In Electronics Packaging

Author : Jennie Hwang
ISBN : 9789401160506
Genre : Science
File Size : 62. 51 MB
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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Surface Mount Technology

Author : Ray P. Prasad
ISBN : 9789401165327
Genre : Science
File Size : 37. 24 MB
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Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.

Walford S Guide To Reference Material Science And Technology

Author : Albert John Walford
ISBN : UOM:39015047531291
Genre : Reference
File Size : 78. 56 MB
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A revised and updated guide to reference material. It contains selective and evaluative entries to guide the enquirer to the best source of reference in each subject area, be it journal article, CD-ROM, on-line database, bibliography, encyclopaedia, monograph or directory. It features full critical annotations and reviewers' comments and comprehensive author-title and subject indexes. The contents include: mathematics; astronomy and surveying; physics; chemistry; earth sciences; palaeontology; anthropology; biology; natural history; botany; zoology; patents and interventions; medicine; engineering; transport vehicles; agriculture and livestock; household management; communication; chemical industry; manufactures; industries, trades and crafts; and the building industry.

Key Concepts In Innovation

Author : Hamsa Thota
ISBN : 9781137327154
Genre : Business & Economics
File Size : 90. 61 MB
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A comprehensive glossary providing clear explanations of the major terms in the field of innovation, covering areas such as product development, design and creativity. By simplifying complex terminology and highlighting key debates, this book is an ideal companion for both students and practitioners in the field.

Infoworld

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ISBN :
Genre :
File Size : 40. 10 MB
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InfoWorld is targeted to Senior IT professionals. Content is segmented into Channels and Topic Centers. InfoWorld also celebrates people, companies, and projects.

Reliability Engineering

Author : Alessandro Birolini
ISBN : 9783642395352
Genre : Technology & Engineering
File Size : 41. 8 MB
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This book shows how to build in, evaluate, and demonstrate reliability and availability of components, equipment, systems. It presents the state-of-the-art of reliability engineering, both in theory and practice, and is based on the author's more than 30 years experience in this field, half in industry and half as Professor of Reliability Engineering at the ETH, Zurich. The structure of the book allows rapid access to practical results. This final edition extend and replace all previous editions. New are, in particular, a strategy to mitigate incomplete coverage, a comprehensive introduction to human reliability with design guidelines and new models, and a refinement of reliability allocation, design guidelines for maintainability, and concepts related to regenerative stochastic processes. The set of problems for homework has been extended. Methods & tools are given in a way that they can be tailored to cover different reliability requirement levels and be used for safety analysis. Because of the Appendices A6 - A8, the book is also self contained from a mathematical point of view, and can be used as a text book or as a desktop reference, with a large number of tables (60), figures (190), and examples (210 of which 70 as problems for homework) to support the practical aspects.

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