chemical mechanical planarization of semiconductor materials springer series in materials science

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Chemical Mechanical Planarization Of Semiconductor Materials

Author : M.R. Oliver
ISBN : 9783662062340
Genre : Technology & Engineering
File Size : 69. 3 MB
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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical Mechanical Planarization Of Semiconductor Materials

Author : M.R. Oliver
ISBN : 9783662062340
Genre : Technology & Engineering
File Size : 87. 77 MB
Format : PDF, Mobi
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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Electrochemically Engineered Nanoporous Materials

Author : Dusan Losic
ISBN : 9783319203461
Genre : Technology & Engineering
File Size : 35. 83 MB
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This book provides in-depth knowledge about the fabrications, structures, properties and applications of three outstanding electrochemically engineered nanoporous materials including porous silicon, nanoporous alumina and nanotubular titania. The book integrates three major themes describing these materials. The first theme is on porous silicon reviewing the methods for preparation by electrochemical etching, properties and methods for surface functionalization relevant for biosensing applications. Biomedical applications of porous silicon are major focus, described in several chapters reviewing recent developments on bioanalysis, emerging capture probes and drug delivery. The second theme on nanoporous alumina starts with describing the concept of self-organized electrochemical process used for synthesis nanopore and nanotube structures of valve metal oxides and reviewing recent development and progress on this field. The following chapters are focused mainly on optical properties and biosensing application of nanoporous alumina providing the reader with the depth of understanding of the structure controlled optical and photonic properties and design of optical biosensing devices using different detection principles such as photoluminescence, surface plasmon resonance, reflective spectrometry, wave guiding, Raman scattering etc. The third theme is focused on nanotubular titania reviewing three key applications including photocatalysis, solar cells and drug delivery. The book represents an important resource for academics, researchers, industry professionals, post-graduate and high-level undergraduate students providing them with both an overview of the current state-of-the-art on these materials and their future developments.

Metallopolymer Nanocomposites

Author : A.D. Pomogailo
ISBN : 9783540265238
Genre : Technology & Engineering
File Size : 47. 93 MB
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This book presents and analyzes the essential data on nanoscale metal clusters dispersed in, or chemically bonded with polymers. Special attention is paid to the in situ synthesis of the nanocomposites, their chemical interactions, and the size and distribution of the particles in the polymer matrix. Numerous novel nanocomposites are described with regard to their mechanical, electrophysical, optical, magnetic, catalytic and biological properties. Their applications, present and future, are outlined.

Advances In Chemical Mechanical Planarization Cmp

Author : Suryadevara Babu
ISBN : 9780081002186
Genre : Technology & Engineering
File Size : 55. 86 MB
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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Handbook Of Silicon Semiconductor Metrology

Author : Alain C. Diebold
ISBN : 9780203904541
Genre : Technology & Engineering
File Size : 70. 88 MB
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Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay, acoustic film thickness, dopant dose, junction depth, and electrical measurements; particle and defect detection; and flatness following chemical mechanical polishing. Providing examples of well-developed metrology capability, the book focuses on metrology for lithography, transistor, capacitor, and on-chip interconnect process technologies.

Wafer Bonding

Author : Marin Alexe
ISBN : 3540210490
Genre : Science
File Size : 70. 59 MB
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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Physical Foundations Of Materials Science

Author : Günter Gottstein
ISBN : 9783662092910
Genre : Technology & Engineering
File Size : 37. 60 MB
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In this vivid and comprehensible introduction to materials science, the author expands the modern concepts of metal physics to formulate basic theory applicable to other engineering materials, such as ceramics and polymers. Written for engineering students and working engineers with little previous knowledge of solid-state physics, this textbook enables the reader to study more specialized and fundamental literature of materials science. Dozens of illustrative photographs, many of them transmission electron microscopy images, plus line drawings, aid developing a firm appreciation of this complex topic. Hard-to-grasp terms such as "textures" are lucidly explained - not only the phenomenon itself, but also its consequences for the material properties. This excellent book makes materials science more transparent.

Evolution Of Thin Film Morphology

Author : Matthew Pelliccione
ISBN : 9780387751092
Genre : Technology & Engineering
File Size : 23. 84 MB
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The focus of this book is on modeling and simulations used in research on the morphological evolution during film growth. The authors emphasize the detailed mathematical formulation of the problem. The book will enable readers themselves to set up a computational program to investigate specific topics of interest in thin film deposition. It will benefit those working in any discipline that requires an understanding of thin film growth processes.

Predictive Simulation Of Semiconductor Processing

Author : Jaroslaw Dabrowski
ISBN : 3540204814
Genre : Technology & Engineering
File Size : 70. 71 MB
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Predictive Simulation of Semiconductor Processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.

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